Metal Deposition

Sigma® Deposition Systems

The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD.

Metal Deposition Technologies

• Standard PVD – conventional sputter modules for low topography features
• Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features
• C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier

Advantages of SPTS PVD

• Single wafer processing, improves yields and on-wafer performance, when compared to batch processing. 
• Planar target with full face erosion
  • avoids re-sputtering, reduces particle contamination
  • improves target life
• Rapid target change (<5mins), with common magnetron increases uptime
• Reliable handling of fragile, thinned or bowed wafers
• "Super Uniformity" option available for specialist applications
• Multi-wafer degas to increase throughput for long (low temp) degas applications
• Common software for 200mm and 300mm systems - ease of use